2011 SMC Update; Materials Market Analysis Panel

Materials Market Analysis Panel

Moderator: Lita Shon-Roy, Techcet Group

Panelists:

Karey Holland, Partner & Senior Technical Analyst

Michael Corbett, Managing Partner, Linx Consulting

Jan Vardaman, President, TechSearch International

Dan Tracy, Senior Director, Industry Research and Statistics, SEMI

 

Holland: Recycling may become more important and have impact on price going forward; expect CMP pad suppliers to shrink through closings or mergers; "3 most critical materials for near term": for FEoL, ALD materials for HK gates: Hf, Zr, La; for BEoL, Mn & Co will increase importance, Ta will drop; Ru will not proliferate;

Corbett: may be some move to less leading edge node devices, into 200mm nodes for example, bumping up demands for materials and consumables used  in those existing manufacturing lines; China market has many obstacles for materials suppliers along with IP concerns, no resolution foreseen; "3 most critical materials for near term": FEol materials are most critical; Ru cost will be an obstacle;

Vardaman: supplier consolidation is leading to concerns and legal issues in EU;  "3 most critical materials for near term": Cu fluctuations can impact major segments;

Tracy: move into lower nodes raising questions about 6-inch material availability; "3 most critical materials for near term": Cu wire transition can drive cost equations, reduce gold positions